Method of reducing substrate noise coupling in mixed signal inte

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257500, 257501, H01L 2701, H01L 2712, H01L 310392, H01L 2976, H01L 2358

Patent

active

060206144

ABSTRACT:
A low cost means is described to semi-isolate the substrate regions of an integrated circuit occupied by a plurality of circuit types with separate power supply connections but with interconnecting signals. The separate power supply connections are made to minimize noise generated by one circuit from coupling into another circuit. One example of integrated circuits with a noise coupling issue are the so called "mixed signal" circuits in which the switching transient noise of digital circuits can interfere with the performance of on board analog circuits. Because of a common substrate, noise injected into the substrate by one circuit can affect the performance of another. This invention reduces the effect of substrate noise by providing an isolation zone around a given circuit type of an integrated circuit by removing the field implant in this zone and placing a deep implant of the same polarity type as substrate in the N channel transistor regions. This implant is tied to local ground or Vss buses and is not present in the isolation zone.

REFERENCES:
patent: 5045912 (1991-09-01), Ohki
patent: 5373476 (1994-12-01), Jeon
patent: 5376816 (1994-12-01), Nishigoori et al.
patent: 5397734 (1995-03-01), Iguchi et al.
patent: 5501993 (1996-03-01), Borland
patent: 5726477 (1998-03-01), Williams et al.
patent: 5856695 (1999-01-01), Ito
John Borland and Ron Koelsch, "MeV Implantation Technology: Next-Generation Manufacturing With Current-Generation Equipment", Solid-State Technology, p. 28, Dec., 1993.

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