Method of reducing particles during the manufacturing of fin or

Details Method of reducing particles during the manufacturing of fin or Method of reducing particles during the manufacturing of fin or

1997-04-07

2000-02-29

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Making passive device

Stacked capacitor

438253, 438254, 438396, H01L 2120, H01L 218242

Patent

active

060308796

ABSTRACT:
The present invention is a method for reducing particles during the manufacturing of fin or cylinder capacitors on a wafer. This invention utilizes a negative photoresist wafer edge exposure process to protect the edge of a wafer. This prevents polysilicon peeling from the edge of the wafer so as to reduce the defects and particles appearing on the wafer.

REFERENCES:
patent: 5175128 (1992-12-01), Ema et al.

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