Method of reducing oxidation of metal structures by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S659000

Reexamination Certificate

active

06933232

ABSTRACT:
The present invention is generally directed to a method of reducing oxidation of metal structures using ion implantation, and a device constructed in accordance with the method. In one illustrative embodiment, the method comprises providing a semiconducting substrate having a first layer of insulating material formed thereabove, the first layer of insulating material having at least one conductive structure positioned therein, and performing an ion implant process to implant ions into at least the one conductive structure.

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patent: 10041298 (1998-02-01), None
Shibata et al., “Lithography-less Ion Implantation Technology for Agile Fab,” ULVAC Confidential.
Shibata et al., “Stencil Mask Ion Implantation Technology for High Performance MOSFETs,” 2000 IEEE.

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