Method of reducing memory card edge roughness by edge coating

Details Method of reducing memory card edge roughness by edge coating Method of reducing memory card edge roughness by edge coating

2007-09-28

2010-10-12

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S460000, C438S465000, C257SE21599, C257SE21700, C257SE21702

Reexamination Certificate

active

07811859

ABSTRACT:
A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

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