Method of purging wafer receiving jig, wafer transfer...

Details Method of purging wafer receiving jig, wafer transfer... Method of purging wafer receiving jig, wafer transfer...

2005-03-15

2005-03-15

Whitehead, Jr., Carl (Department: 2829)

Semiconductor device manufacturing: process

Miscellaneous

C034S565000, C141S063000

Reexamination Certificate

active

06867153

ABSTRACT:
A FOUP having semiconductor wafers received therein is transferred to a loading port and then the door of the FOUP is fixed and removed by a FIMS door and then the semiconductor wafers are taken out of the shell of the FOUP and then a predetermined manufacturing processing is performed to the semiconductor wafers. After performing the manufacturing processing, the semiconductor wafers are returned into the shell and the FIMS door is returned to a closed position and the shell is retracted about 50 mm to 65 mm to form a gap between the FIMS door and the shell. Then, purge gas is introduced from a gas introduction pipe arranged above the loading port on the left and right sides in a slanting forward direction of the FIMS door into the shell to replace the atmosphere in the shell with the purge gas.

REFERENCES:
patent: 5988233 (1999-11-01), Fosnight et al.
patent: 6473996 (2002-11-01), Tokunaga
patent: 6-334019 (1994-12-01), None
patent: 9-246354 (1997-09-01), None
patent: 11-91864 (1999-04-01), None
SEMI Standard E57, E1.9, E47.1.

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