Method of purging photoresist from semiconductor wafer...

Details Method of purging photoresist from semiconductor wafer... Method of purging photoresist from semiconductor wafer...

2006-12-05

2006-12-05

Bashore, Alain L. (Department: 1762)

Coating processes

Spraying

C427S426000, C427S427500, C427S127000, C118S702000, C118S703000, C118S699000

Reexamination Certificate

active

07144601

ABSTRACT:
The purging of photoresist from a supply device of semiconductor coating equipment is automatically executed in a controlled manner. The equipment employs a plurality of photoresist bottles for storing the same kind of photoresist. A plurality of supply pipes are respectively connected to the photoresist bottles, respectively. A valve system selectively opens and closes the supply pipes in response to control signals generated by a main controller. A dispense pump forces the photoresist in the open supply pipe through a nozzle. A purge start button issues a purge start command signal to the controller when the button is pressed. The controller then controls the valve system and the dispense pump so as to automatically purge the photoresist according to a sequence effected using a timer.

REFERENCES:
patent: 3992301 (1976-11-01), Shippey et al.
patent: 4090475 (1978-05-01), Kwan
patent: 5330101 (1994-07-01), Turner et al.
patent: 6332924 (2001-12-01), Shim et al.

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