Method of pulling silicon ribbon through shaping guide

Details Method of pulling silicon ribbon through shaping guide Method of pulling silicon ribbon through shaping guide

1974-07-17

1976-05-04

Ribando, Curtis P.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156617, 23273SP, B01J 1724, C01B 3302

Patent

active

039545512

ABSTRACT:
A ribbon of semiconductor material is formed by supplying powdered semiconductor material at the bottom of a rectangular tube shaping guide while heating the semiconductor material in the region of the guide to produce a molten body of semiconductor material within the guide. The upper surface of the melt is contacted with a seed ribbon which is drawn upward while maintaining the supply of semiconductor material adjacent to the bottom of the guide.

REFERENCES:
patent: 2809136 (1957-10-01), Mortimer
patent: 3031275 (1962-04-01), Shockley
patent: 3124489 (1964-03-01), Vogel, Jr. et al.
patent: 3265469 (1966-08-01), Hall
patent: 3453352 (1969-07-01), Goundry
patent: 3617223 (1971-11-01), Boatman

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