Method of providing semiconductor pellet with heat sink

Details Method of providing semiconductor pellet with heat sink Method of providing semiconductor pellet with heat sink

1976-03-03

1978-10-31

Dean, R.

Metal treatment

Compositions

Heat treating

29590, 75153, 75154, 75159, 148 115Q, 148 13, 148 132, 148 32, C22F 108

Patent

active

041232933

ABSTRACT:
A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and silicon interposed therebetween consists mainly of copper and contains a small amount of a metal other than copper and has been subjected to an annealing treatment.

REFERENCES:
patent: 1969702 (1934-08-01), Crampton et al.
patent: 2599002 (1952-06-01), Klement
patent: 2897107 (1959-07-01), Carlen et al.
patent: 2971251 (1961-02-01), Willemse
patent: 3047437 (1962-07-01), Brown, Jr.
patent: 3097198 (1963-07-01), Fishwick et al.
patent: 3143442 (1964-08-01), Watts
patent: 3335126 (1967-08-01), Baron et al.
patent: 3342804 (1967-09-01), Mueller
patent: 3359256 (1967-12-01), Mueller et al.
patent: 3398135 (1968-08-01), Mueller
patent: 3406164 (1969-10-01), Altermatt et al.
patent: 3445454 (1969-05-01), Fishwick et al.
patent: 3522235 (1970-07-01), Baron et al.
patent: 3544550 (1970-12-01), Anderton et al.
patent: 3592807 (1971-07-01), Von Brachel et al.
patent: 3637651 (1972-01-01), Baron et al.

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