Method of providing printed circuits

Details Method of providing printed circuits Method of providing printed circuits

1978-03-13

1979-03-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156667, 156901, 156904, 204 15, 427 98, 428901, C23F 102

Patent

active

041441184

ABSTRACT:
There is provided an improvement in the method of preparing printed circuit boards by chemically catalyzing the surface of an insulating material, electrolessly depositing a layer of copper thereon, masking selected areas of the copper layer not correspnding to the desired pattern of conductor lines, electrolytically depositing additional copper on the unmasked areas, removing the masking material and etching away the copper from the previously masked areas. The improvement comprises the steps of forming an etch-resistant protective layer of oxide on the surface of the electrolytically deposited copper layer before removing the masking material, then removing the masking material and etching away the electrolessly deposited copper from the previously masked areas.

REFERENCES:
patent: 3296099 (1967-01-01), Dinella
patent: 3745094 (1973-07-01), Greene
patent: 3764399 (1973-10-01), Caule
patent: 4075757 (1978-02-01), Malm etal.

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