Method of providing an adherent metal coating on an epoxy surfac

Details Method of providing an adherent metal coating on an epoxy surfac Method of providing an adherent metal coating on an epoxy surfac

1983-10-20

1986-04-15

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156902, 204 30, 204 321, 204192E, 204192EC, 427 40, 427 98, 427 99, 427306, 427307, H05K 338, H05K 324, H05K 306, C25D 556

Patent

active

045825645

ABSTRACT:
A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

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