Method of providing a patterned relief of cured photoresist on a

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask is exposed to nonimaging radiation

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264167, 425363, 425374, 216 54, 216 23, 216 44, 427264, 430313, B44C 122, B29C 3700

Patent

active

054258480

ABSTRACT:
A description is given of a method and a device (1) for providing (replicating) a patterned resyntetic resin relief (37) on the surface (25) of a glass substrate (27). For this purpose, a UV-curable acrylate lacquer (33) is applied to the surface (25), after which a transparent mould (3) having a relief (13) is rolled-off over the surface (25). By means of a UV light source (17) and an elliptic mirror (21), the lacquer is cured at the location of the focal line (23), thereby forming said relief (37). The relief (13) of the mould (3) is replicated on the glass substrate (27). The method described enables a relief of small dimensions (10.times.10 .mu.m) to be seamlessly provided on a large fiat surface (1.times.1 m), without being hindered by large release forces.

REFERENCES:
patent: 4543225 (1985-09-01), Beaujean
patent: 5259926 (1993-11-01), Kuwabara et al.

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