Method of protecting microfabricated devices with protective...

Details Method of protecting microfabricated devices with protective... Method of protecting microfabricated devices with protective...

2006-02-21

2006-02-21

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S106000, C438S113000, C438S125000, C438S055000

Reexamination Certificate

active

07001793

ABSTRACT:
A method of using protective caps (160) applied to a first side of a wafer (150) in the production of microfabricated devices (152), such as micro-electro-mechanical systems (MEMS) devices. One cap (160) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.

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