Method of protecting bond wires during molding and handling

Details Method of protecting bond wires during molding and handling Method of protecting bond wires during molding and handling

1996-08-28

1998-04-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257779, 257784, 257695, 257772, H01L 2350, H01L 2348, H01L 2330, H01L 2328

Patent

active

057367922

ABSTRACT:
A method of making a semiconductor device and the device wherein a chip is provided having plural bond pads thereon. A plurality of adjacent wires is provided, each wire having one end thereof coupled to and extending from one of the bond pads. The other end of each wire is coupled to one of a plurality of lead fingers. A mass of hardenable, flowable adhesive having a viscosity in its flowable state sufficient to enable the adhesive to rest on a the wire until hardened, preferably an epoxy, is disposed on adjacent wires and the adhesive is then hardened. Optionally, some of the adhesive is permitted to be disposed on a surface of the chip and beneath a wire and then hardened.

REFERENCES:
patent: 4707725 (1987-11-01), Ito
patent: 4819041 (1989-04-01), Redmond
patent: 4888634 (1989-12-01), Lai et al.
patent: 5359227 (1994-10-01), Liang et al.
patent: 5389738 (1995-02-01), Piosenka et al.
patent: 5569956 (1996-10-01), Chillara et al.

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