Method of protecting aluminum nitride circuit substrates during

Details Method of protecting aluminum nitride circuit substrates during Method of protecting aluminum nitride circuit substrates during

1991-09-04

1994-04-26

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427226, 427255, 427304, 427309, 427405, 427437, 4274431, C23C 2600

Patent

active

053063899

ABSTRACT:
A process for protecting aluminum nitride circuit substrates during electroless plating using surface oxidation. The aluminum nitride substrate is coated with a metal stack. The coating on the substrate is etched to form a circuit pattern. The patterned substrate is then fired in an oxidizing atmosphere at a temperature and time sufficient to convert the exposed aluminum nitride to aluminum oxide. After this conversion, the substrate is plated in an electroless solution forming a microwave circuit ready for component attachment and packaging.

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