Method of protecting aluminum nitride circuit substrates during

Details Method of protecting aluminum nitride circuit substrates during Method of protecting aluminum nitride circuit substrates during

1993-08-10

1994-10-25

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427304, 427305, 427309, 427405, 427437, 4274431, 4273837, C23C 2600

Patent

active

053585976

ABSTRACT:
The present invention describes a process for protecting aluminum nitride circuit substrates during electroless plating using a sol-gel technique. The aluminum nitride substrate is coated with a metal. The coated substrate is etched to form a circuit pattern thereby exposing the aluminum nitride. The etched substrate is placed in a solution of tetraethylorthosilicate and withdrawn. The substrate is dried in air and then baked in an oven to remove all of the organic solvents leaving a stoichio metric film of silica on the exposed substrate. The substrate is then placed in an electroless plating solution and the circuit pattern is plated to a predetermined thickness.

REFERENCES:
patent: 4886766 (1989-12-01), Dwivedi
patent: 4964923 (1990-10-01), Takeuchi
patent: 5058799 (1991-10-01), Zsamboky
patent: 5082163 (1992-01-01), Kanahara
patent: 5082700 (1992-01-01), Dwivedi
patent: 5100714 (1992-03-01), Zsamboky

Affiliated with

Also associated with

Rating

Method of protecting aluminum nitride circuit substrates during does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of protecting aluminum nitride circuit substrates during , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of protecting aluminum nitride circuit substrates during will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-132630