Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-08-16
2011-08-16
Aftergut, Jeff H (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S084000, C156S153000, C156S293000
Reexamination Certificate
active
07998296
ABSTRACT:
A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.
REFERENCES:
patent: 5074456 (1991-12-01), Degner et al.
patent: 5583370 (1996-12-01), Higgins et al.
patent: 5745331 (1998-04-01), Shamouilian et al.
patent: 5753132 (1998-05-01), Shamouilian et al.
patent: 5886863 (1999-03-01), Nagasaki et al.
patent: 6073577 (2000-06-01), Lilleland et al.
patent: 6108189 (2000-08-01), Weldon et al.
patent: 6194322 (2001-02-01), Lilleland et al.
patent: 6310755 (2001-10-01), Kholodenko et al.
patent: 6376385 (2002-04-01), Lilleland et al.
patent: 6462928 (2002-10-01), Shamouilian et al.
patent: 6490146 (2002-12-01), Wang et al.
patent: 6538872 (2003-03-01), Wang et al.
patent: 6721162 (2004-04-01), Weldon et al.
patent: 6723202 (2004-04-01), Nagaiwa et al.
patent: 2002/0036881 (2002-03-01), Shamouilian et al.
patent: 2003/0211757 (2003-11-01), Gondhalekar et al.
patent: 2004/0060661 (2004-04-01), Nishimoto et al.
patent: 2-126433 (1990-05-01), None
International Preliminary Report on Patentability dated Jan. 22, 2008, issued in PCT Application No. PCT/US2006/027090.
Examination Report mailed Oct. 27, 2010 for corresponding Singapore Appln. No. 200800380-8.
Examination Report mailed Aug. 5, 2009 for corresponding Singapore Appln. No. 200800380-8.
Comendant Keith
Ricci Tony
Tappan Jim
Aftergut Jeff H
Buchanan & Ingersoll & Rooney PC
Lam Research Corporation
LandOfFree
Method of protecting a bond layer in a substrate support... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of protecting a bond layer in a substrate support..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of protecting a bond layer in a substrate support... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2657605