Method of production of semiconductor module with external...

Details Method of production of semiconductor module with external... Method of production of semiconductor module with external...

2006-06-20

2006-06-20

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C438S613000, C438S666000

Reexamination Certificate

active

07064001

ABSTRACT:
A method of production of a semiconductor module comprised of a semiconductor chip, external connection terminal pads for bonding with solder balls or other external connection terminals, wires electrically connecting the same, and a sealing resin layer sealing the semiconductor chip, external connection terminal pds, and wires, where surfaces of the external connection terminal pads are exposed at bottoms of recesses formed in the sealing resin layer, comprising sealing by a resin external connection terminal pads and soluble metal layers formed at surfaces of the metal substrate by electroplating to form a sealing resin layer at that one surface, then etching away the metal substrate and soluble metal layers to thereby form in the resin sealing layer recesses exposing the external connection terminal pads at their bottoms by a single etching process without requiring special etching stop control.

REFERENCES:
patent: 6204162 (2001-03-01), Yonemochi et al.
patent: 59-208756 (1984-11-01), None

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