Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-05-18
1982-06-22
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156252, 156280, 156634, 156645, 1566591, 156901, 174 685, 427 97, C23F 102
Patent
active
043361005
ABSTRACT:
Molded laminates useful in the preparation of electrically conductive panels are provided by a method comprising providing an article comprising a metal carrier or support layer, at least one insulating layer and a copper outer layer, the carrier having a plurality of perforations therethrough which are substantially filled with the insulating material, and compressing the layered article to produce a molded laminate. In other embodiments, the method comprises the further steps of forming a hole through at least some of the filled perforations, and, if desired, sensitizing the walls of the holes to electroless metal deposition and depositing a layer of metal thereon. Articles produced by the methods of this invention are also provided.
REFERENCES:
patent: 3334395 (1967-08-01), Cook et al.
patent: 3435127 (1969-03-01), Rose et al.
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3934334 (1976-01-01), Hanni
patent: 3969816 (1976-07-01), Swengel et al.
Kollmorgen Technologies Corporation
Powell William A.
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