Method of production of electrically conductive panels and insul

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29852, 156252, 156280, 156634, 156645, 1566591, 156901, 174 685, 427 97, C23F 102

Patent

active

043361005

ABSTRACT:
Molded laminates useful in the preparation of electrically conductive panels are provided by a method comprising providing an article comprising a metal carrier or support layer, at least one insulating layer and a copper outer layer, the carrier having a plurality of perforations therethrough which are substantially filled with the insulating material, and compressing the layered article to produce a molded laminate. In other embodiments, the method comprises the further steps of forming a hole through at least some of the filled perforations, and, if desired, sensitizing the walls of the holes to electroless metal deposition and depositing a layer of metal thereon. Articles produced by the methods of this invention are also provided.

REFERENCES:
patent: 3334395 (1967-08-01), Cook et al.
patent: 3435127 (1969-03-01), Rose et al.
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3934334 (1976-01-01), Hanni
patent: 3969816 (1976-07-01), Swengel et al.

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