Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Having heterojunction
Patent
1996-12-17
1998-12-08
Niebling, John
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Having heterojunction
438312, 438513, 438514, 438563, 438564, 148DIG10, 148DIG58, 148DIG59, 148DIG72, 257198, 257592, 257593, H01L 21331
Patent
active
058468676
ABSTRACT:
A method of producing a bipolar transistor includes the step of forming an emitter contact layer containing a high concentration of impurity by means of plasma doping or solid-state diffusion without causing diffusion of impurity in a base layer. This makes it possible to realize a thin base layer having a high impurity concentration.
The invention also provides a method of producing a semiconductor device including a bipolar transistor and another device element such as a resistor element including a polysilicon layer containing an activated impurity in such a manner that both the bipolar transistor and the device element are disposed on the same single substrate, the method including the steps of: forming a polysilicon layer containing an activated impurity on the surface of a substrate; and then forming a base layer of the bipolar transistor. This method prevents the base layer from being affected by heat treatment on the polysilicon layer.
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patent: 5494836 (1996-02-01), Imai
patent: 5504018 (1996-04-01), Sato
patent: 5663097 (1997-09-01), Sakamoto et al.
Ammo Hiroaki
Gomi Takayuki
Niebling John
Pham Long
Sony Corporation
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