Method of producing semiconductor devices

Details Method of producing semiconductor devices Method of producing semiconductor devices

1990-07-10

1992-08-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156646, 156656, 156662, 118728, 118 501, 118620, 20429825, 20429835, H01L 21306, B44C 122, C03C 1500, C23F 100

Patent

active

051356082

ABSTRACT:
A process and apparatus for producing semiconductor integrated circuit devices wherein the dry processing and the wet processing are continuously effected for the wafers to be processed, and the wafers are transferred between these processings under a vacuum condition or in a purging gas without being allowed to come in contact with the open air, to avoid adverse effects that will be caused by the open air.

REFERENCES:
patent: 4825808 (1989-05-01), Takahashi et al.

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