Method of producing semiconductor device

Details Method of producing semiconductor device Method of producing semiconductor device

1991-06-24

1993-12-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437190, 437203, 437246, 148DIG26, H01L 2144

Patent

active

052702537

ABSTRACT:
A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness and so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.

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patent: 3818279 (1974-06-01), Seeger, Jr. et al.
patent: 3868724 (1975-02-01), Perrino
Oswald et al, "Application of Table Automated . . . ," Solid State Technology, Mar. 1977, pp. 33-38.
Bross et al, "Lift-Off Trench Process . . . ," IBM Tech. Discl. Bull., vol. 25, No. 4, Sep. 1982, pp. 1892-1894.
German Reference pp. 323-333.
Bhattachalya et al, "Reduction of Tip Fractures . . . ," IBM Tech. Discl. Bull., vol. 24, No. 7A, Dec. 1981, pp. 3399-3400.
Lai et al, "Polymers in Electronics," Solid State Technology, Dec. 1984, pp. 149-154.
Totta et al, "SLT Device Metallurgy . . . ," IBM J. Res. Develop., 13 pp. 226-238 (1969).

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