Method of producing printed circuits

Details Method of producing printed circuits Method of producing printed circuits

1982-12-30

1984-04-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 1566591, 156902, 156904, 174 685, 204 15, 204 23, 427 97, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044446195

ABSTRACT:
A method of producing a printed circuit comprising printing a plating resist onto the clean surface of a layer of electrically conductive material on at least one side of a substrate so as to leave exposed only the required track areas of the surface; electroplating over the track areas a metal alloy, preferably a palladium
ickel alloy, which will act as an etch resist for the underlying electrically conductive material, which has good solderability, which has a melting point higher than 250.degree. C., and which will provide a base for gold plate; removing the plating resist; and removing the layer of electrically conductive material from the non-track areas by etching.

REFERENCES:
patent: 4075757 (1978-02-01), Malm et al.

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