Method of producing printed circuit boards

Details Method of producing printed circuit boards Method of producing printed circuit boards

1982-03-15

1984-02-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 28, 134 29, 156655, 1566591, 156668, 156902, 252 792, 252 794, 252 795, 427 96, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

044301545

ABSTRACT:
The present invention relates to a semi-additive or full-additive process for producing printed circuit or conductor boards having improved electrical resistance in which the coating of adhesive medium exposed between the trains of conductors is removed or partially removed without corroding the base material or copper of the conductor trains by a treatment with an alkaline permanganate or chromic acid solution and suitable washing steps carried out subsequently.

REFERENCES:
patent: 2728693 (1955-12-01), Cado
patent: 2893150 (1959-07-01), Tann
patent: 3508983 (1970-04-01), Origer et al.

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