Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing
Reexamination Certificate
2011-06-28
2011-06-28
Johnson, Christina (Department: 1742)
Plastic and nonmetallic article shaping or treating: processes
Laser ablative shaping or piercing
C264S482000, C264S171100, C428S131000, C428S138000, C428S040100
Reexamination Certificate
active
07968039
ABSTRACT:
To produce a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated through through-holes, and yet the through-holes are not readily visible at a substrate surface, a pressure-sensitive adhesive surface of a pressure-sensitive adhesive layer12in a laminate comprising a substrate11and the pressure-sensitive adhesive layer12is irradiated with a CO2laser having a pulse width of from 1 to 140 μsec, a pulse energy at each processing point of from 0.01 to 3.0 mJ, and a beam spot diameter at each processing point of from 30 to 160 μm, so as to form through-holes2having a diameter at the surface of the substrate11of from 0.1 to 42 μm at a hole density of from 30 to 50,000 per 100 cm2.
REFERENCES:
patent: 3949134 (1976-04-01), Willdorf
patent: 4895745 (1990-01-01), Vesley et al.
patent: 5779832 (1998-07-01), Kocher
patent: 6110595 (2000-08-01), Suzuki et al.
patent: 6388231 (2002-05-01), Andrews
patent: 6441340 (2002-08-01), Varriano-Marston
patent: 6890617 (2005-05-01), Yamaguchi et al.
patent: 2003/0059563 (2003-03-01), Bourdelais et al.
patent: 2005/0074578 (2005-04-01), Yamaguchi et al.
patent: 2006/0222813 (2006-10-01), Kato et al.
patent: 2006/0228511 (2006-10-01), Bourdelais et al.
patent: 1 267 205 (2002-12-01), None
patent: 1 577 358 (2005-09-01), None
patent: 1 270 694 (2006-10-01), None
patent: 1-125345 (1989-08-01), None
patent: 02-107682 (1990-04-01), None
patent: 04-055489 (1992-02-01), None
patent: 4-100235 (1992-08-01), None
patent: 2003-129014 (2003-05-01), None
patent: 2003-183602 (2003-07-01), None
patent: 2004-002805 (2004-01-01), None
patent: WO 01/51580 (2001-07-01), None
patent: WO 2004/061032 (2004-07-01), None
Translation of JP 1-125345 U.
Kancharla et al., Fabrication of Biodegradable Polymeric Micro-Devices Using Laser Micromachining, May 2002, Biomedical Microdevices vol. 4, Issue 2, pp. 105-109.
Snakenborg et al., Microstructure fabrication with a CO2 laser system, Oct. 15, 2003, Journal of Micromechanics and Microengineering, pp. 182-189.
Gan, E.K.W.; Zheng, H.Y.; Lim, G.C., “Laser drilling of micro-vias in PCB substrates,” Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd , vol., No., pp. 321-326, 2000.
Definition of “laminated”, Oxford English Dictionary, 2010.
International Search Report for corresponding International application No. PCT/JP2005/010512.
Communication issued from the European Patent Office on Feb. 5, 2009 for the corresponding European patent application No. 05748624.3—2102.
Kanazawa Osamu
Kato Kiichiro
Tsuda Kazuhiro
Johnson Christina
Lintec Corporation
Posz Law Group , PLC
Schiffman Benjamin
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