Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-08-16
1992-05-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156647, 156651, 156653, 156657, 1566591, 1566611, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
051164620
ABSTRACT:
A micromechanical sensor is described for the AFM/STM profilometry, incorporating a cantilever beam with at least one tip at its end and a mounting block at the opposite end. A method is described incorporating the steps of coating a wafer substrate with an insulating layer, forming a mask in the insulating layer, etching a trench in the wafer substrate, removing the insulating layer, coating the desired cantilever beam and tip material, respectively, etching the cantilever beam and tip material, and removing at least a portion of the supporting wafer material from the bottom side. The invention overcomes the problem of forming a micromechanical sensor having a cantilever beam, a tip with a predetermined shape and a mounting block.
REFERENCES:
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4916002 (1990-04-01), Carver
patent: 4943719 (1990-07-01), Akamine et al.
patent: 4968585 (1990-11-01), Albrecht et al.
Bartha Johann W.
Bayer Thomas
Greschner Johann
Kraus Georg
Weiss Helga
International Business Machines - Corporation
Powell William A.
Trepp Robert M.
LandOfFree
Method of producing micromechanical sensors for the AFM/STM prof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing micromechanical sensors for the AFM/STM prof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing micromechanical sensors for the AFM/STM prof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-417204