Method of producing microbump circuits for flip chip mounting

Details Method of producing microbump circuits for flip chip mounting Method of producing microbump circuits for flip chip mounting

1990-06-01

1992-06-02

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 430329, 156643, 156650, 427 96, 427259, G03F 700, G03C 558

Patent

active

051185849

ABSTRACT:
In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.

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