Method of producing mechanical components of MEMS or NEMS...

Details Method of producing mechanical components of MEMS or NEMS... Method of producing mechanical components of MEMS or NEMS...

2011-04-26

2011-04-26

Chaudhari, Chandra (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE21219

Reexamination Certificate

active

07932118

ABSTRACT:
A mechanical component production method of a MEMS/NEMS structure from a monocrystalline silicon substrate includes forming anchoring zones in one face of the substrate. A lower protective layer, non-silicon, obtained by epitaxy from the face of the substrate is formed on the face. A silicon layer obtained by epitaxy from the lower protective layer is formed on the lower protective layer. An upper protective layer is formed on the silicon layer. The upper protective, silicon and lower protective layers are etched according to a pattern defining the component, until the substrate is reached, providing access routes to the substrate. A protective layer is formed on the walls formed by the etching in the epitaxied silicon layer. The component is released by isotropic etching of the substrate from the access routes, wherein the isotropic etching does not attack the lower and upper protective layers and the protective layer of the walls.

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