Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2010-09-01
2011-12-20
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S733000
Reexamination Certificate
active
08080478
ABSTRACT:
According to one embodiment, a method of producing a mask includes: a step of forming a pattern on a substrate; a step of forming a first film that covers the top surface and side surface of the pattern and contains a first material; a step of forming a second film containing a second material on the first film; a step of performing anisotropic etching of the first and second films in a way that forms a sidewall layer including the first and second films on the side surface of the pattern and removes the first and second films on any location other than the sidewall layer; a step of performing isotropic etching of the first film of the sidewall layer; and a step of removing the pattern.
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Ito Jun-ichi
Kamata Chikayoshi
Kashiwada Saori
Ohsawa Yuichi
Kabushiki Kaisha Toshiba
Le Thao P.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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