Method of producing hard multilayer film formed material

Details Method of producing hard multilayer film formed material Method of producing hard multilayer film formed material

1995-03-07

1995-10-31

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427249, 4272557, 427294, 4274197, 427574, 427577, 427578, 427585, B05D 306

Patent

active

054627753

ABSTRACT:
A hard multilayer film structure comprises a titanium-containing compound layer possessing high wear resistance deposited on a substrate and a silicon-containing hard carbon layer possessing self-lubricating properties, high wear resistance and high resistance to heat. Deposition of these layers is effected by the plasma-enhanced chemical vapor deposition technique. As a raw gas for the deposition of silicon-containing hard carbon-layer, the gas containing tetramethyl silane or tetraethyl silane is used. Deposition of the silicon-containing hard carbon layer is carried out at a temperature of not more than 550.degree. C. and a pressure in the range of 0.05 to 0.5 Torr.

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Dialog Abstract for FR 2 596 775 as of Jun. 3, 1994.

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