Method of producing flexible printed-circuit board covered with

Details Method of producing flexible printed-circuit board covered with Method of producing flexible printed-circuit board covered with

1991-11-27

1993-08-10

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 156239, 1562726, 156278, 156323, 1563311, 174259, 428202, 4284735, B32B 3100

Patent

active

052345220

ABSTRACT:
A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

REFERENCES:
patent: 4937133 (1990-06-01), Watanabe et al.
patent: 5089346 (1992-02-01), Imaizumi et al.

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