Method of producing electronic circuit and electronic circuit

Semiconductor device manufacturing: process – Direct application of electrical current

Reexamination Certificate

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Details

C438S670000, C438S951000

Reexamination Certificate

active

07067398

ABSTRACT:
According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.

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Yamaguchi, et al., “New Process of Manufacturing Printed Circuit Boards Using Electrophotography Technology”, 2004 ICEP Proceedings, pp. 168-172, (Apr., 2004).

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