Method of producing conductor circuit boards

Details Method of producing conductor circuit boards Method of producing conductor circuit boards

1987-10-16

1988-12-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29848, 156151, 156153, 156233, 156236, 156240, 156249, 156631, 156634, 156645, 156650, 156656, 1566591, 156902, 156666, 204 15, 204 23, 204 321, B44C 122, C03C 1500, C03C 2506, C23F 100

Patent

active

047909021

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a method of producing conductor circuit boards adapted to be incorporated in IC cards, electronic equipment, etc.


BACKGROUND ART

With the recent development of lighter or thinner, higher-performance versions of IC cards, electronic devices, etc., circuit patterns of conductor circuit boards incorporated therein tend to become still higher in density and less in thickness. Accordingly, there is a demand for a method for efficiently mass-producing such conductor circuit boards of high quality.
As a conventional method of producing conductor circuit boards, there is the so-called etching method in which a copper foil with a thickness of 18 .mu.m to 35 .mu.m or more is bonded to the surface of an insulating substrate, made of e.g. glass-epoxy resin, for lamination, the surface of the copper foil is masked with use of a resist, such as a photoresist, printing resist, etc., and undesired portions of the foil surface except conductor circuits are removed by etching.
According to this method, however, it is economically difficult to reduce the thickness of the copper foil of the copper-clad substrate on account of problems on processes of production. Essentially, therefore, this method is unfit for the production of thin-film versions of conductor circuit boards. It is necessary, moreover, to use a copper foil with a thickness of 18 .mu.m or more in order to fully stand a tensile force, bending force, etc., which are physically applied during processes after the production of the copper foil, including surface treatment, cutting, and lamination on the insulating substrate. It is therefore difficult to obtain a copper-clad substrate with a copper-foil thickness of 5 to 10.mu. which are required for the production of higher-density versions of conductor circuits.
As means for settling these problems of the etching method, conductor circuit boards are conventionally known which are manufactured by the so-called transfer method. Examples of such conductor circuit boards are disclosed in Japanese Patent Publication No. 55-32239 (U.S. Pat. No. 4,053,370), Japanese Patent Publication No. 57-24080, Japanese Patent Publication No. 57-39318, Japanese Provisional Patent Publication No. 60-147192, etc.
In a method (hereinafter referred to as belt transfer method) of producing conductor circuit boards disclosed in Japanese Patent Publication No. 55-32239 (U.S. Pat. No. 4,053,370), Japanese Patent Publication No. 57-24080, and Japanese Patent Publication No. 57-39318, a conductor circuit board is produced in the following manner. A resist mask is applied to the surface of a thin, electrically conductive metal belt which slides on the outer peripheral surface of a metallic rotating drum or a cathode portion of a horizontal plating apparatus. The metal belt, for use as a cathode, is transported while being kept at a predetermined distance from an insoluble anode. A plating solution is supplied compulsorily between the metal belt and the anode at high speed, thereby electrolytically forming a conductor circuit on the surface of the metal belt. After an insulating substrate, having a bonding agent previously applied thereto, is adhered to the conductor circuit, the insulating substrate and the conductor circuit are peeled from the metal belt, and the conductor circuit is coated with an overlay for lamination, as required. Thus, the conductor circuit board is completed. Adapted for high-speed plating, the belt transfer method has the advantage over the conventional etching method that it permits very fast formation of the conductor circuit and continuous production of the conductor circuit boards. However, the belt transfer method is subject to the following drawbacks. During a peeling step in which the insulating substrate, having the conductor circuit transferred thereto, is peeled from the metal belt, part of the conductor circuit may not be able to be transferred to the insulating substrate, due to the difference between the strength of adhesion between the conductor circuit a

REFERENCES:
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4606787 (1986-08-01), Pelligrino
patent: 4715116 (1987-12-01), Thorpe et al.

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