Method of producing conductor circuit boards

Details Method of producing conductor circuit boards Method of producing conductor circuit boards

1989-03-31

1989-12-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156631, 156634, 156645, 156656, 1566591, 1566611, 156902, 156151, 156233, 156249, 204 15, 204 23, 427 97, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

048895849

ABSTRACT:
A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching. In the case of producing a conductor circuit board with a through hole, a through hole is formed after the step of separating the conductive substrate, and then through-hole plating is carried out, followed by the removal of exposed portions of the thin metal film by etching.

REFERENCES:
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 2984597 (1961-05-01), Hennes
patent: 4790902 (1988-12-01), Wada et al.

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