Method of producing boards for printed wiring

Details Method of producing boards for printed wiring Method of producing boards for printed wiring

1993-04-14

1995-09-12

Kuhns, Allan R.

Plastic and nonmetallic article shaping or treating: processes

Forming articles by uniting randomly associated particles

Stratified or layered articles

264261, 2642711, 26427217, 26432818, B29C 4514

Patent

active

054494800

ABSTRACT:
A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin, the molding material containing 50 to 90% by volume of the powdery inorganic filler based on the total of the molding material.

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