Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-03-21
2006-03-21
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C029S843000, C205S253000, C228S180210
Reexamination Certificate
active
07013564
ABSTRACT:
A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.
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Inaba Yoshiharu
Ishida Toshiharu
Nakatsuka Tetsuya
Nishimura Asao
Okudaira Hiroaki
Antonelli, Terry Stout and Kraus, LLP.
Hitachi , Ltd.
Nguyen Donghai D.
Trinh Minh
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