Method of producing acceleration sensor chip package

Details Method of producing acceleration sensor chip package Method of producing acceleration sensor chip package

2007-12-27

2009-12-08

Chapman, John E (Department: 2856)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

Reexamination Certificate

active

07629193

ABSTRACT:
An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

REFERENCES:
patent: 6316840 (2001-11-01), Otani
patent: 6405592 (2002-06-01), Murari et al.
patent: 6876093 (2005-04-01), Goto et al.
patent: 7267007 (2007-09-01), Nakamura
patent: 11-135804 (1999-05-01), None

Affiliated with

Also associated with

Rating

Method of producing acceleration sensor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing acceleration sensor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing acceleration sensor chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4088599