Method of producing a wiring board

Details Method of producing a wiring board Method of producing a wiring board

2006-10-16

2008-12-30

Arbes, C. J (Department: 3729)

Track sanders

Sand feeders

Chain

C029S847000, C427S096100

Reexamination Certificate

active

07469941

ABSTRACT:
A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

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Yamaguchi, et al., “New Process of Manufacturing Printed Circuit Boards Using Electrophotography Technology”, 2004 ICEP Proceedings, pp. 168-172, (Apr. 2004).

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