Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-12-10
1993-08-10
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
437 62, 437225, 437974, 148DIG12, 148DIG135, 156633, 156643, H01L 21306
Patent
active
052345351
ABSTRACT:
A method of forming a thin silicon SOI layer by wafer bonding, the thin silicon SOI layer being substantially free of defects upon which semiconductor structures can be subsequently formed, is disclosed. The method comprises the steps of:
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Beyer Klaus D.
Hsu Louis L.
Silvestri Victor J.
Yapsir Andrie S.
Balconi-Lamica Michael J.
Dang Trung
Hearn Brian E.
International Business Machines - Corporation
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