Method of producing a semiconductor wafer using ultraviolet sens

Details Method of producing a semiconductor wafer using ultraviolet sens Method of producing a semiconductor wafer using ultraviolet sens

1996-11-07

1998-11-24

Geist, Gary

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438 33, 438 63, 438113, 438114, 438759, 438690, 438691, 438455, 438459, H01L 21302

Patent

active

058406140

ABSTRACT:
A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconductor wafer, back lapping a second surface of the wafer, opposite to the first surface, and irradiating the ultraviolet sensitive tape with ultraviolet rays to release the ultraviolet sensitive tape from the wafer.

REFERENCES:
patent: 5238876 (1993-08-01), Takeuchi
patent: 5284803 (1994-02-01), Haisma
patent: 5332406 (1994-07-01), Takeuchi
patent: 5590787 (1997-01-01), Hodges
CA:122:83257 abstract of JP06177094 Jun. 1994.
WPIDS AN:244003 abstract of JP06188094 Jun. 1996.
CA:114:44495, Abst of JP02187278, Satsuma, "Releasable adhesives for favrication of semiconductor wafers" Jun. 1990.

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