Method of producing a semiconductor wafer and a cleaning apparat

Details Method of producing a semiconductor wafer and a cleaning apparat Method of producing a semiconductor wafer and a cleaning apparat

1997-06-30

1999-07-13

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 4, 134 2219, 134 40, C03C 2300, B08B 700, B08B 900

Patent

active

059221372

ABSTRACT:
A method of producing a semiconductor wafer in which a semiconductor wafer cut by a wire saw can be cleaned efficiently and in automatic steps and abrasive grains are substantially completely removed away, and a cleaning apparatus for the method are provided. A semiconductor ingot is cut by a wire saw into cut semiconductor wafers. Each of the cut semiconductor wafers is degrease-cleaned, the semiconductor wafer which has been degrease-cleaned is oil-water separation-cleaned, the semiconductor wafer which has been oil-water separation-cleaned is rinsed, abrasive grains are removed away from the surface of the semiconductor wafer which has been rinse-cleaned, by alkali cleaning, the semiconductor wafer which has been abrasive grain removal-cleaned is separated from a slicing plate.

REFERENCES:
patent: 3128213 (1964-04-01), Gault et al.
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patent: 4372788 (1983-02-01), Lancz
patent: 4501258 (1985-02-01), Dyer et al.
patent: 5599438 (1997-02-01), Shiramizu et al.
patent: 5674827 (1997-10-01), Kawashima et al.
patent: 5762779 (1998-06-01), Shiramizu et al.

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