Method of producing a semiconductor-metal contact through a...

Details Method of producing a semiconductor-metal contact through a... Method of producing a semiconductor-metal contact through a...

2006-01-03

2006-01-03

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S688000

Reexamination Certificate

active

06982218

ABSTRACT:
A method of electrically contacting a semiconductor layer (13) coated with at least one dielectic layer (12) which is coated with a metal layer the metal layer (11) is applied on the dielectric layer (12) and the metal layer (11) is temporarily locally heated in a line, linear or dotted pattern by means of a source of radiation (9) in a controlled manner in such a way that a local molten mixture, is formed consisting exclusively of the metal layer (11), the dielectric layer (12) and the semiconductor layer (13) are located directly underneath the metal layer (11) and upon solidification, leads to an electrical contact between the semiconductor layer (13) and the metal layer (11).

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R. Preu et al: “Laser Ablation—A New Low-cost Approach for Passivated Rear Contact Formation in Crystalline Silicon Solar Cell Technology”, 16thEuropean Photovoltaic Solar Energy Conference, vol. II, May 1-5, 2000, pp. 1181-1184, XP002200822, Glasgow, UK.

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