Method of producing a semiconductor device

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148DIG93, H01L21/268

Patent

active

059045507

ABSTRACT:
A method of preparing a semiconductor device, comprising: forming an amorphous silicon layer on a substrate, and applying shots of an excimer laser beam to the amorphous silicon layer to convert the amorphous silicon layer into a polysilicon layer having a plurality of silicon grains, each of the grains having a grain size and including a crystallite having a crystallite size on the (111) plane, an average value of the crystallite sizes on the (111) plane of the crystallites included in the polysilicon layer being sixty percent or greater of an average value of the grain size.

REFERENCES:
patent: 4625224 (1986-11-01), Nakagawa et al.
patent: 4649624 (1987-03-01), Reedy
patent: 4693759 (1987-09-01), Noguchi et al.
patent: 5145808 (1992-09-01), Sameshima et al.
patent: 5200630 (1993-04-01), Nakamura et al.
patent: 5200846 (1993-04-01), Hiroki et al.
patent: 5365875 (1994-11-01), Asai et al.
patent: 5366926 (1994-11-01), Mei et al.
Einspruch, Norman, VLSI Handbook, pp. 181-185 (1985) no month.
Roth, et al, "Effects of Impurities on the Kinetics of Nucleation and Growth in Amorphous Silicon" (1986) pp. 319-325, Materials Research Society, (No Month).
Kumomi, et al, "Manipulation of Nucleation Sites in Solid-state Si Crystallization" (1991) pp. 3565-3567, Applied Physics Letters, 59, No. 27 (No Month).
Patent Abstracts of Japan, vol. 007, No. 045 (E-160), Feb. 1983 of JP-A-57 194 517 (Tokyo Shibaura Denki KK) Nov. 1982.
Patent Abstracts of Japan, vol. 013, No. 123 (E-773) Mar. 1989 of JP-A-63 292 618 (NEC Corp) Nov. 1988.
Kobayashi, et al, "Recrystallization of Polycrystalline Silicon Islands on Fused Silica" (1983) pp. 35-38, Japanese Journal of Applied Physics, Supplements (No Month).
Patent Abstracts of Japan, 014, No. 396 (E-0970) (1990) of JP-A-02 148 831 (Hitachi Ltd) Jun. 1990.
Teruo Katoh, "Characteristics of MOSFET's on Large Grain Polysilicon Films" (1988), pp. 923-928, IEEE Transactions on Electron Devices, 35, No. 7 (No Month).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1755892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.