Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-12-21
1995-02-14
Woo, Jay H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156628, 1566591, 156646, 264 25, 264107, 264220, 425810, B44C 122, B29D 1700
Patent
active
053893131
ABSTRACT:
A method produces a molding die for an information recording medium, having a mold surface with a prescribed unevenness pattern comprising a projection; the projection having different etching velocities along its projected thickness; and defining a pair of convergent opposite inclining side slopes. Each slope of the pair forms an acute inclining angle with respect to extension of the mold surface. A pattern-forming layer is formed comprising a common metal element throughout its thickness and an additional element differing in composition from the common metal element in the thickness direction of the pattern-forming layer. The common metal element and the additional elements have different etching velocities in the thickness direction of the pattern-forming layer. The pattern-forming layer is selectively etched with a common etchant to form the projection.
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Hiraoka Mizuho
Imataki Hiroyuki
Satoh Tetsuya
Tamura Tomoyuki
Canon Kabushiki Kaisha
Smith Duane S.
Woo Jay H.
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