Method of producing a light-emitting diode

Details Method of producing a light-emitting diode Method of producing a light-emitting diode

2005-05-17

2005-05-17

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S028000, C438S033000, C438S047000, C438S107000, C438S127000, C257S099000

Reexamination Certificate

active

06893890

ABSTRACT:
A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip40mounted on plate-shaped wiring means60inside a light-emitting diode. Wiring means60comprises conductive paths61and62that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths61, 62are connected electrically to LED chip40, extending from the position where the LED is mounted to leads21and22, to which they are connected by soldering. LED chip40is supported by being held inside concave part23in one lead21at this time.

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