Method of producing a layered structure

Details Method of producing a layered structure Method of producing a layered structure

1984-06-15

1987-10-06

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156655, 1566611, 156668, 2041923, 20419232, 357 71, 430314, 430317, 439228, B44C 122, C23F 102

Patent

active

046981250

ABSTRACT:
A method of producing a layered structure, the method including forming a spacer layer on a substrate, forming a parting layer on the spacer layer, forming a first masking pattern on the parting layer the first masking pattern delineating field regions in a first metal layer, etching the spacer layer and the parting layer in accordance with the first masking pattern, depositing a first metal layer, depositing an etch barrier layer, dissolving the parting layer to remove the masking pattern and the first metal layer and etch barrier layer in the field regions, depositing a passivation layer on the spacer layer, depositing a dielectric layer on the passivation layer, forming a second masking pattern on the dielectric layer, exposing the etch barrier layer in accordance with the second masking pattern, depositing a second metal layer, forming a third masking pattern on the second metal layer and etching the second metal layer in accordance with the third masking pattern.

REFERENCES:
patent: 3985597 (1976-10-01), Zielinski
patent: 4076575 (1978-02-01), Chang
patent: 4172004 (1979-10-01), Alcorn et al.
patent: 4367119 (1983-01-01), Logan et al.
patent: 4410622 (1983-10-01), Dalal et al.
patent: 4536249 (1985-08-01), Rhodes
patent: 4536951 (1985-08-01), Rhodes et al.
Hitchner, J. E., "Chromium as an RIE Etch Barrier", IBM Techn. Discl. Bulle., vol. 22, No. 10, Mar. 1980, pp. 4516-4517.

Affiliated with

Also associated with

Rating

Method of producing a layered structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a layered structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a layered structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2115932