Method of producing a contact system on the rear of a...

Details Method of producing a contact system on the rear of a... Method of producing a contact system on the rear of a...

2006-09-05

2006-09-05

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S618000, C257SE21505

Reexamination Certificate

active

07101773

ABSTRACT:
The present invention relates to a process for making a contact point (8) on the rear surface of a component including at least one first substrate (10) with at least one active region (12) and at least one second substrate (20) for protecting the active region. In accordance with the invention, a second substrate of a non-insulating material is used and at least one through insulation trench (21) is made in it surrounding a part (22) of this substrate, said part being in contact with the active region when the first and second substrates are assembled.Application to sensor conditioning.

REFERENCES:
patent: 5987989 (1999-11-01), Yamamoto et al.
patent: 6065341 (2000-05-01), Ishio et al.
patent: 6338284 (2002-01-01), Najafi et al.
patent: 6894358 (2005-05-01), Leib et al.
patent: 199 62 231 (2001-07-01), None
patent: 0 611 967 (1994-08-01), None
patent: 2 754 386 (1998-04-01), None
International Search Report, for International Application No. PCT/FR02/03225, date mailed Sep. 23, 2003.

Affiliated with

Also associated with

Rating

Method of producing a contact system on the rear of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a contact system on the rear of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a contact system on the rear of a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3528217