Method of processing a resin sheet with a laser beam

Details Method of processing a resin sheet with a laser beam Method of processing a resin sheet with a laser beam

1998-02-24

2000-09-05

Vargot, Mathieu D.

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

21912166, 21912169, 264482, B23K 2600

Patent

active

061138355

ABSTRACT:
A method of forming a separation groove and a ditch for cutting a thermoplastic resin sheet by a laser beam is performed as follows. A heat-resistant layer made of thermosetting resin is printed on the rear surface of the resin sheet along the line of the ditch to be formed by the laser beam. A laser beam is radiated on the front surface of the resin sheet and scanned along the line of the ditch and the separation groove. The laser beam melts and evaporates resin and forms the ditch and the separation groove. Since the rear end of the ditch is covered by the heat-resistant layer, the resin sheet is not completely separated along the ditch line, while it is separated along the separation groove line. At the final stage, the resin sheet is cut along the ditch line. A flexible circuit sheet for making electrical connection can be easily and cost effectively processed in this laser beam process.

REFERENCES:
patent: 3435186 (1969-03-01), Roshon, Jr. et al.
patent: 3790744 (1974-02-01), Bowen
patent: 4854974 (1989-08-01), Carlson et al.
patent: 5018817 (1991-05-01), Suzuki et al.
patent: 5227098 (1993-07-01), Philby et al.
patent: 5229180 (1993-07-01), Littmann

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