Coating processes – Electrical product produced
Reexamination Certificate
2005-05-24
2005-05-24
Jolley, Kirsten (Department: 1762)
Coating processes
Electrical product produced
C427S343000, C427S344000, C427S354000, C427S384000, C427S402000
Reexamination Certificate
active
06896927
ABSTRACT:
An electronic device substrate, such as a semiconductor silicon wafer or a liquid crystal glass substrate, with a surface which has just undergone cleaning treatment and which is covered with a clean oxide or nitride film which will readily adsorb organic contaminants is treated with an aqueous solution containing choline, or alternatively a similar substrate which has not been cleaned is treated with a treatment solution comprising a SC-1 solution to which choline has been added. Following drying, a surface concentration of choline of between 5×1010molecules˜7×1012molecules/cm2is adsorbed onto the substrate surface. This treatment suppresses organic contamination of the substrate from the atmosphere. As a result, the surface carbon concentration of an electronic device substrate can be suppressed to a value of no more than approximately 3×1013atoms/cm2, even for manufacturing processes carried out in typical clean rooms with no chemical filters installed.
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Jolley Kirsten
Nomura Micro Science Co., LTD
Tama Chemicals Co., LTD
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