Method of preventing etch masking during wafer etching

Details Method of preventing etch masking during wafer etching Method of preventing etch masking during wafer etching

1979-04-30

1981-02-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156662, H01L 21306

Patent

active

042513170

ABSTRACT:
As a cassette holding wafers in an etchant bath is rotated, nitrogen gas is bubbled through the cassette adjacent the wafers to agitate the wafers, so as to ensure that etchant reaches all edge portions of the wafers.

REFERENCES:
patent: 3745079 (1973-07-01), Cowles
patent: 3799177 (1974-03-01), Thomas
patent: 3977926 (1976-08-01), Johnson et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 4, Sep. 1976, Bubble Burst Etching by G. L. Hutchins, pp. 1455-1456.

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