Method of preparing printed circuit boards with terminal tabs

Details Method of preparing printed circuit boards with terminal tabs Method of preparing printed circuit boards with terminal tabs

1976-06-04

1977-04-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156659, 156666, 252 793, 427 96, 427328, C23F 102

Patent

active

RE0291811

ABSTRACT:
A method for rapidly stripping solder or tin from a substrate, such as copper, without adversely affecting the substrate in the preparation of circuit boards having terminal tabs. The composition comprises hydrofluoric acid or salts thereof, ammonia and an oxygen source such as hydrogen peroxide. The use of a soluble metal complexer peroxide stabilizer enables use of larger percentages of fluoride and peroxide to materially increase the life and capacity of the product. The composition is especially useful in a process of rapidly stripping solder from copper terminal tabs of a printed circuit board, following which the exposed copper tab is plated with a more noble metal.

REFERENCES:
patent: 3158517 (1964-11-01), Schwarzenberger
patent: 3537926 (1970-11-01), Fischer
patent: 3615950 (1971-10-01), Lacal
patent: 3677949 (1972-07-01), Brindisi et al.

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